JIS

Chip Wirewound Inductor

TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...