环境特征
必备条件 特性 测试方法
弯曲强度 The forces applied on the right conditions must not damage the terminal electrode and the ferrite Test device shall be soldered on the substrate Substrate Dimension:100×40×1.6mm
Deflection: 2.0mm
Keeping Time: 30sec
For 0402, substrate dimension is 100×40×0.8mm
耐振动 Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1min Amplitude : 1.5mm
Time : 2hrs for each axis (X,Y&Z), total 6hrs
耐焊接热 Appearance: No damage
More than 75% of the terminal electrode should be covered with solder.
Impedance: within ± 30% of initial value 		Pre-heating: 150°C, 1min
Solder Temperature: 260 ± 5°C
Immersion Time: 10 ± 1sec
可焊性 The electrodes shall be at least 90% covered with new solder coating Pre-heating: 150°C, 1min
Solder Temperature: 245 ± 5°C
Immersion Time: 4 ± 1sec
端子拉引强度 0402 series : ≥ 0.2kg
0603 series : ≥ 0.5kg
0805 series : ≥ 1.0kg
other series : ≥ 2.0kg 		Test device shall be soldered on the substrate
温度周期 Appearance: No damage Impedance: within ± 30% of initial value One cycle:
One cycle/step1: -55 ± 3°C for 30min
step2: 25 ± 2°C for 3.0min
step3:125 ± 3°C for 30min
step4:25 ± 2°C for 3.0min
Total: 100cycles
Measured after exposure in the room condition for 24hrs
防潮性能 Temperature: 40 ± 2°C
Relative Humidity: 90 ~ 95% time: 1000hrs
Measured after exposure in the room condition for 24hrs
耐高温 Temperature: 125 ± 3°C
Relative Humidity : 0%
Applied Current: Rated Current time: 1000hrs
Measured after exposure in the room condition for 24hrs
低温特性 Temperature: -55 ± 3°C
TR elative Humidity : 0% time: 1000hrs
Measured after exposure in the room condition for 24hrs

如何订购 - 积层式芯片磁珠
TRMB160808 Y TR Y N 060
型号
TRMB100505
TRMB160808
TRMB201209
TRMB321611
TRMB322513
TRMB451616
TRMB453215
阻值公差
Y ± 25%
M ± 20%
包装
TR 编带卷装
设计规范
Y ui:200
Q ui:75
电流
H 高电流
N 标准电流
阻抗
060 6 Ω
100 10 Ω
330 33 Ω
152 1500 Ω

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